DEEP Concept is a French SME specialised in the packaging for Power Electronics, with high skills in High Voltage. As Expert in the development of new power packaging technologies with companies from all domains and laboratories around the world, DEEP Concept has a large experience in material, interfaces and interconnections such as selective die metallisation, die-attach, 3D integration, double side cooling, etc. The use of Multiphysics simulation tools permits to create appropriate designs for robust manufacturing. In particular, DEEP Concept engineers have access to PRIMES platform, to be able to design, simulate, manufacture and characterize new power module technologies for High Voltage applications. The manufacturing of micro-series of Power Modules can be based on conventional or innovative solutions, from single chip packaging to complete power modules or full converters.
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